Overview of Cadmium Zinc Telluride (CZT) X-ray Diffraction Instrument
Overview of Cadmium Zinc Telluride (CZT) X-ray Diffraction Instrument
Cadmium Zinc Telluride (CZT) is an important II-VI group semiconductor material, widely used in detectors for infrared rays, X-rays, γ-rays, and other high-energy rays. To ensure the quality and performance of this material, X-ray diffraction technology is employed to detect its crystal structure and defects. The following are key points about the CZT X-ray diffraction instrument:
1. Automated X-ray Topography and High-Resolution Diffraction
- JV-QCRT Model X-ray Topography Instrument: Utilizes the latest numerical X-ray diffraction imaging (XRDI) technology to identify defects in single crystal substrates through reflection mode. This method allows observation of lattice defects without polishing or etching the single crystal wafer.
- High-Resolution X-ray Diffraction (HRXRD) for Rocking Curve Measurement: A common technique to characterize the crystal quality of single crystal substrates or epitaxial materials. By measuring the rocking curve width (e.g., Full Width at Half Maximum, FWHM) under different relative intensities, the crystallinity of the tested material can be reflected. A wider FWHM indicates lower crystallinity and more defects, while multiple peaks suggest regions with different lattice orientations within the measurement area.
2. Equipment Features
- Automation Program: The equipment is equipped with an automated program to achieve automatic calibration, measurement, data collection, processing, and generation of final numerical topographic images for samples. Samples can be rapidly scanned in a 75-μm resolution survey mode to quickly locate critical defects.
- Upgraded Models: For example, the JV-QCVelox-E high-resolution X-ray diffractometer, in addition to basic functions, is equipped with an automated robotic arm to enable fully automated in-line detection.
3. Application Fields
- Crystal Defect Identification: XRDI topography can reveal the crystallinity and variations of CZT substrates, which correspond to the crystal quality of single crystal substrates. HRXRD rocking curve data aligns with defect results observed in XRDI topography, indicating that these two technologies can quickly and effectively identify crystal defects.
- Basis for Device Manufacturing: XRDI images can be used to determine suitable areas for wafer slicing, providing a basis for device manufacturing. This helps improve production efficiency and product quality.
4. Influence of Test Parameters
According to relevant studies, test parameters such as incident beam slit width, integration time, scanning step size, and the surface processing state of samples all affect the effect of X-ray diffraction topography. Among them, the incident beam slit width has a significant impact on X-ray diffraction imaging of CZT crystals and crystal quality screening applications.
Conclusion
The application of automated X-ray topography and high-resolution diffraction technologies in CZT single crystal production not only improves detection efficiency but also ensures product quality. The development of these technologies is of great significance for promoting the widespread application of CZT materials in military, medical, and other fields.
